1.同前端设计团队，以及本地的后端团队合作进行超大规模ASIC的物理设计
2.完成综合，布局布线，时钟树综合，物理验证，静态时序分析

1.有过16nm及以上芯片完整后端设计经验
2.熟悉FC，INVS，primetime, starRC, 等EDA 工具
3.熟悉解决timing，congestion，等问题的方法
4.熟悉DRC，LVS，IVD，EM，Xtalk分析与修复
5.能独立完整block级别的整体设计

1.Architect the company’s next-gen networking ASIC devices
2.Work closely with global architect team to understand modeling needs, focus on Packet Processor’s Flexible pipeline programming
3.Develop bitwise accurate functional models (C-model) (by using C/C++) to simulate our new architectures and solutions
4.Develop solid test suites and perform functional verification & validation with the C-Model and RTL simulation
5.Develop and optimize Packet Processor’s Flexible pipeline by using advanced modeling methodologies
6.Working with software team to translate use case requirements into implementation specifications, and program the Packet Processor’s pipeline
7.Working with ASIC design and DV team to accomplish target ASIC product
8.Review all blocks’ micro architecture specifications and software development to ensure all system architectural requirements are followed
9.Track relevant industry standards and IP technical evaluation

1.3+ years of complex high-speed digital IC architecture experience; or related work experience
2.Master’s degree in Electrical Engineering or Computer Engineer or related field required; Ph.D. degree is a plus
3.Strong working knowledge of System C or C++, or relevant programming language
4.Good knowledge of networking protocols and RFCs; Excellent knowledge of 2/3 layers network protocols is a big plus
5.Excellent knowledge of ARM subsystem, PCIe and industry standard peripherals including I2C, UART, SPI
6.Experiences with complex networking ASIC architecture is a big plus
7.Good communication skills, strong positive attitude, and ability & desire to work as a team player;
8.Outstanding problem-solving skills
9.Self-learning capability

1.SDK模块设计和开发
2.验证芯片功能

1.电子、计算机、自动化等相关专业本科以上，1-3年相关工作经验
2.熟悉Linux嵌入式开发
3.具备丰富的C语言开发经验
4.熟悉二三层网络协议
5.精通Python者优先
6.熟悉BROADCOM/BAREFOOT/MARVELL等交换芯片SDK者优先

1.SDK模块设计，开发和测试
2.编写用户参考代码
3.验证芯片功能
4.支持客户工程师开发

1.电子、计算机、自动化等相关专业本科以上，3-5年相关工作经验。
2.熟悉Linux嵌入式开发
3.具备丰富的C语言开发经验
4.熟悉二三层网络协议（VLAN， VXLAN, NVGRE, IPv4/IPv6, Multicast等）
5.熟悉交换机QoS相关功能
6.精通Python者优先
7.熟悉BROADCOM/BAREFOOT/MARVELL等交换芯片SDK者优先

1.应用于可编程交换芯片的自研P4语言编译器相关开发
2.验证芯片功能

1. 电子、计算机、自动化等相关专业本科以上
2. 熟悉Linux嵌入式开发
3. 具备丰富的C++语言开发经验
4. 精通Python者优先
5. 有编译器开发经验优先
6. 熟悉二三层网络协议优先